Inspection Services

1. 2.5D & 3D X-Ray Non-Destructive Inspection Services
  • 1-1 PCB Back-Drill Inspection (including stub length)
  • 1-2 Semiconductor Glass (Silicon) Plate Inspection (TGV/TSV)
ItemConfiguration
Tube64 W
FOVSpecific
DetectorFlat Panel / CCD
Resolution0.5~500 um/pixel
LoaderSpecific
Device Dimension~2x2x2 m3
Device Power220-230 V
Recon. Image256x256~1000x1000
Safety< 0.5 uSv/hour