X-Ray設備

技術服務

1. 2.5D & 3D X-Ray非破壞檢測
  • 1-1 PCB背鑽檢測 (包含Stub Length ,面銅厚,訊號層銅厚,PAD直徑,VIA ,孔銅厚)
  • 1-2 半導體玻璃(矽)板(TGV/TSV)檢測
ItemConfiguration
Tube64 W
FOVSpecific
DetectorFlat Panel / CCD
Resolution0.5~500 um/pixel
LoaderSpecific
Device Dimension~2x2x2 m3
Device Power220-230 V
Recon. Image256x256~1000x1000
Safety< 0.5 uSv/hour